HiSiliconMemorabilia
OnMay7,2020,HuaweiHiSilicon’ssalesreached2.67billionyuanTheUSdollaralsoenabledHuaweiHiSilicontoentertheglobalsemiconductorTOP10listforthefirsttime.
OnJune19,2018,ShanghaiHiSiliconCo.,Ltd.,basedontheShanghaiR&DCenter,wasestablished,anditsproductswerelaunchedtothepublicmarketforthefirsttime.
InJanuary2017,Kirin960wasselectedasthe"BestAndroidPhoneProcessorof2016"byAndroidAuthority.
InOctober2016,HiSiliconreleasedtheKirin960,whichhasaGPUthatis180%higherthanthepreviousgeneration,andismainlyequippedwithHuaweimate9.
OnFebruary23,2016,HuaweiKirin950wontheGTIInnovativeTechnologyProductAwardatthe2016MobileWorldCongress.
InMay2015,HuaweiHiSiliconannouncedthecompletionofLTECat.11trialswithQualcomm,withamaximumdownlinkrateof600Mbps.
InApril2015,HiSiliconreleasedtheKirin935,whichismainlyequippedwiththeHuaweiP8high-endversionandHonor7.
In2015atMWC,HiSiliconreleaseda64-bit8-corechip,HiSiliconKirin930,whichismountedonHonorX2andHuaweiP8(someversions).
OnDecember3,2014,HiSiliconreleaseda64-bit8-corechip-Kirin620(kirin620),whichisequippedwithHonorPlay4X/4CandHuaweiP8YouthEdition.
OnOctober13,2014,HiSiliconreleasedtheHiSiliconKirin928chip,anditwasinstalledintheHuaweiHonor6ExtremeEdition
OnSeptember4,2014,HiSiliconreleasedthesuperocta-coreHiSilicon925chip,4ARMA7cores,4ARMA15cores,plusacoprocessor,built-inbasebandtosupportLTECat.6standardnetwork,equippedwithHuaweimate7,Honor6Plus
June2014HiSiliconReleasedtheocta-coreHiSiliconKirin920chip,andlauncheditonHuaweiHonor6thatmonth.
InMay2014,HiSiliconreleasedthequad-coreKirin910T(kirin910T),equippedonHuaweiP7.
InFebruary2012attheCESconferenceinBarcelona,HiSiliconreleasedthequad-coremobilephoneprocessorchipK3V2,anditwaslaunchedwithAscendD
InJune2008,HiSiliconparticipatedinthe2008TaipeiInternationalComputerExhibition(COMPUTEXTAIPEI).)
InMarch2008,HiSiliconreleasedtheworld'sfirstultra-low-powerDVB-Csinglechipwithbuilt-inQAM
InMarch2008,HiSiliconparticipatedinthe16thChinaInternationalRadioandTelevisionInformationNetworkExhibition(CCBN2008)
InNovember2007,HiSiliconparticipatedinthe2007ChinaInternationalSocialSecurityProductsExpo
InAugust2007,HiSiliconparticipatedinGDSFCHINA2007
p>InAugust2007,HiSiliconparticipatedinICChina2007
InMarch2007,HiSiliconparticipatedinthe15thChinaInternationalRadioandTelevisionInformationNetworkExhibition(CCBN2007)
InOctober2006,HiSiliconparticipatedinthe2006ChinaInternationalSocialPublicSafetyProductsExpo
InJune2006,HiSiliconlaunchedthepowerfulH.264videocodecchipHi3510attheTAIPEICOMPUTEXexhibition
InJune2006,HiSiliconparticipatedinthe10thChinaInternationalSoftwareExpoin2006
InNovember2005,HiSiliconparticipatedinthesecurityexhibition,Mr.Aigaveaspeechtomanysecuritymanufacturers
InOctober2004,ShenzhenHiSiliconSemiconductorCo.,Ltd.wasregisteredandthecompanywasformallyestablished.
Attheendof2003,HiSilicon’sfirsttensofmillionsofgate-levelASICsweresuccessfullydeveloped
In2002,HiSilicon’sfirstBlockCOTchipwassuccessfullydeveloped
In2001,WCDMAbasestationchipwassuccessfullydeveloped
In2000,HiSilicon’sfirstmillion-gateASICwassuccessfullydeveloped
1998HastySuccessfuldevelopmentofadigital-analoghybridASIC
In1996,HiSilicon’sfirst100,000-gateASICwassuccessfullydeveloped
In1993,HiSilicon’sfirstdigitalASICwassuccessfullydeveloped
>In1991,HuaweiASICDesignCenter(thepredecessorofShenzhenHiSiliconSemiconductorCo.,Ltd.)wasestablished
HonorsandContributions
InJune2014,theworld’sfirstCat6chipwaslaunched——HisiliconKirin920.
InJune2009,itlaunchedtheK3platformusingtheMobilesmartoperatingsystem.
InApril2006,itpassedISO9001certification.
InFebruary2006,itpassedtheShenzhenHigh-techEnterpriseQualificationCertification.
InDecember2005,itwasrecognizedasanintegratedcircuitdesignenterprise.
InOctober2005,itpassedthecertificationofdesignatedunitsfortheproductionofcommercialcryptographicproducts.
InJanuary2005,thefirstself-developed10GNP(NetworkProcessor)waslaunchedinChina.
InOctober2004,320Gswitchingnetworkchipsand10Gprotocolprocessingchipsweresuccessfullydeveloped,markingthatHiSiliconhasmasteredthecorechiptechnologyofhigh-endrouters.
December2003,undertookthedevelopmentofthethird-generationmobilecommunicationdedicatedchips(chipsets)forkeybreakthroughprojectsinkeyareasofGuangdongProvince,whichwillbeusedinWCDMAterminals.
InNovember2003,theworld'sleadinghigh-endopticalnetworkchipwaslaunched.Thechipusesa0.13umprocesswithadesignscaleofmorethan13milliongates.HiSiliconhasmasteredthecorechiptechnologyintheopticalnetworkfieldandhasbeguntotakethelead.
InJuly2003,undertookthedevelopmentofcorerouterchipsfortheNational863Project,providinghigh-endroutersandhigh-endEthernetswitcheswithswitchingnetworkchipsandIPprotocolprocessingchipswithprocessingcapabilitiesof320Gandabove.
InMarch2001,thefirstdomesticWCDMAbasestationpackagewaslaunched,markingthatHiSiliconwasattheforefrontof3Gtechnology.
InApril2020,itwasselectedasoneofthetop200Chineseimportcompaniesin2019.
OnAugust4,2020,HiSiliconrankedNo.1amongthetop50Chinesenewinnovativeenterprisesin2020.
Chipproducts
Mobileprocessor
K3V1 | td> | |||
K3V2 | 40nm | 4xA91.4GHz | VivanteGC4000 | |
K3V2E | 4xA91.5GHz | |||
Kirin620 | 28nm | 6series | 8xA531.2GHz | Mali-450MP4500MHz |
kirin910 | 28nm | 9series | 4xA91.6GHz | Mali-450MP4533MHz |
kirin910T | 28nm | 9series | 4xA91.8GHz | Mali450MP4 |
Kirin920 | 28nm | 9 | 4xA151.7GHz+4xA71.3GHz | Mali-T624MP4600MHz |
kirin925 | 28nm | 9series | 4xA151.8GHz+4xA71.3GHz | Mali-T624 |
Kirin928 | 28nm | 9series | 4xA152.0GHz+4xA71.3GHz | Mali-T628MP4 |
Kirin930 | 28nm | 9series | 4xA532.2-1.9GHz+4xA531.5GHz | Mali628MP4680MHz |
Kirin935 | 28nm | 9series | 4xA532.2GHz+4xA531.5GHz | Mali-T628 |
Kirin650 | 16nm | 6series | 4xA532.36GHz+4xA531.7GHz | Mali-T830900MHz |
kirin659 | 16nm | 6series | 4xA532.0GHz+4xA531.7GHz | Mali-T830MP2 |
Kirin950 | 16nm | 9series | 4xA722.3GHz+4xA531.8GHz | MaliT880MP4 |
kirin955 | 16nm | 9series | 4xA722.5GHz+4xA531.8GHz | MaliT880MP4900MHz |
Kirin960 | 16nm | 9series | 4xA732.4GHz+4xA531.8GHz | MaliG71MP8 p> |
kirin710 | 12nm | 7series | 4×A732.2GHz+4×A531.7GHz | MaliG51 |
kirin970 | 10nm | 9series | 4xA73+4xA53 | Mali-G72MP12 |
Kirin810 Kirin820 | 7nm 7nm | 8series 8series | 2xA762.27GHz+6xA551.88GHz 1*Cortex-A76Based2.36GHz+3*Cortex-A76Based2.22GHz+4*Cortex-A551.84GHz | Mali-G52 Mali-G77 |
Kirin980 Kirin985 | 7nm 7nm | 9series 9series | 2xA762.6GHz+2xA761.92Ghz+4xA551.8Ghz 1*Cortex-A76Based2.58GHz+3*Cortex-A76Based2.40G+4*Cortex-A551.84GHz | Mali-G76MP10 Mail-G77 |
kirin990 | 7nm | 9series | 2xA762.86GHz+2xA762.09GHz+4xA551.86GHz | Mali-G76MP16 td> |
Kirin9905G | 7nm+EUV td> | 9series | 2xA762.86GHz+2xA762.36GHz+4xA551.95GHz | Mali-G76MP16 |
Kirin9000E | 5nm | 9series | 1xA773.13GHz+3xA772.54GHz+4xA552.04GHz | Mali-G78MP22 |
kirin9000 | 5nm | 9series | 1xA773.13GHz+3xA772.54GHz+4xA552.04GHz | Mali-G78MP24 |
Communicationbaseband
Barong700 | LTETDD/FDD |
Barong710 | LTEFDD/TDDCat.4 |
Balong720 | LTEFDD/TDDCat.6 td> |
Barong730 | LTECat.12andCat.13UL |
Barong765 | LTECat.19 |
Barong5G01 | 3GPPRel.15 |
Barong5000 | 2G/3G/4G/5Gmulti-mode |
AIprocessor
Shengteng310 | 8W |
Shengteng910 | 350W |
ServerProcessor
Kunpeng920 | ARMv8.2 | 7nm | 64 | 2.6GHz | 180W |
Networkprocessing
Name | Bandwidth | Networking | CPU | Powerlinetransmissionprotocol | Hardwareengine | Wirelessfrequencyband | Transmissionstandard | WiFi | Security |
Lingxiao650 | 160MHz@E2E | Wi-Fi+PLChybridnetworking | 4-coreCortex-A53@1.4GHz | WiFioffloading | TrustZone td> | ||||
Hi6530 | Quad-coreCortexA9 | G.hngigabitpowerline,PLCTurbo | IPv4/IPv6 p> | 2.4GHz&5GHz | 802.11ac/a/n, 802.11b/g/n |
Competitors
Qualcomm,SamsungElectronics,Nvidia,MediaTek,etc.
