element

Maincategories

Antiviruscomponents,electroniccomponents,pneumaticcomponents,Hallcomponents,flashcomponents,hydrauliccomponents,electricalcomponents,Excomponents.

Hall

Introduction

HallelementisasemiconductorthatusestheHalleffect.Itisgenerallyusedtodeterminetherotorspeedinamotor,suchasthemagneticDrums,coolingfansincomputers,etc.;isamagneticsensorbasedontheHalleffect,whichhasdevelopedintoadiversefamilyofmagneticsensorproductsandhasbeenwidelyused.

Fabricationmaterials

Hallelementscanbefabricatedwithavarietyofsemiconductormaterials,suchasGe,Si,InSb,GaAs,InAs,InAsP,andmultilayersemiconductorheterostructurequantumwellmaterials,etc..

Advantages

Halldeviceshavemanyadvantages,andtheirstructureisfirm.Smallsize,lightweight,longlife,easyinstallation,lowpowerconsumption,highfrequency(upto1MHZ),vibrationresistance,notafraidofpollutionorcorrosionbydust,oil,watervaporandsaltspray.

Hydraulic

Classification

Hydrauliccomponentsmainlyincludeone-wayvalve,pressurereducingvalve,overflowvalve,pressureregulatingvalve,flowregulatingvalve,hydrauliccylinderhydraulicPumps,hydraulicmotorvalves(pressurevalves,flowvalves,reversingvalves),hydraulicaccessories(oilfilterdevices,sealingrings,pipejoints),andreversingvalves,solenoidvalves,etc.

Uses

Hydrauliccomponentshaveawiderangeofuses.Hydraulicpressmanufacturers,aswellasmetallurgicalsteelcompanies,usethemmoreoften,andtheyareanimportantpartofautomationequipment.

Pneumatic

Classification

Pneumaticcomponentsaregenerallydividedinto:cylinder,quickconnector,cylinderflowrestrictor,pneumaticdelayvalve,filter,PUhose,Miniaturejoints,universalthreadedjoints,pneumaticvalves,dryers,pressurereliefvalves+solenoidvalvecontrol+cylinders,etc.

Application

Pneumaticcomponentscanbeusedin:foodindustry,clothingindustry,printingindustry,semiconductorindustry,automobileindustry.Ifyouputthepneumaticairsourcepart(compressedair,vacuum,airFilterunit);controlpart(varioussolenoidvalves,pneumaticvalves,manualvalves,speedcontrolvalves,on-offvalves,reliefvalves,pressurereducingvalves),executiveparts(pneumaticsuctioncups,cylinders,pneumaticfingers,etc.)connectedtogetherIfyoulookatit,youwillfindthatthemovementrealizedbyelectricenergycanberealizedbypneumatic.

Disadvantages

However,thedisadvantagesofpneumaticcomponentsarepoorpositioningaccuracy(duringoperation)andhighnoise.

InFLASHanimationproduction,weoftenneedtousecomponents.

Definition

Acomponentisagraphic,buttonorasmallanimationthatcanberepeatedlytakenout.Thesmallanimationinthecomponentcanbeplayedindependentlyofthemainanimation,andeachcomponentcanbemultipleindependentAcombinationofelements.Toputitbluntly,acomponentisequivalenttoareusabletemplate,andusingacomponentisequivalenttoinstantiatingacomponententity.Theadvantageofusingcomponentsisthattheycanbereused,reducingfilestoragespace.

Function

TherearemanytimesintheFLASHthatneedtoreusematerials,thenwecanconvertthematerialsintocomponents,orsimplycreatenewcomponents.Inordertofacilitaterepeateduseoreditandmodifyagain.Componentscanalsobeunderstoodasoriginalmaterials,whichareusuallystoredinacomponentlibrary.Theelementcanbemodifiedagain,butmodifyingtheelementinthescenewillnotmodifythepropertiesoftheelementitself.

Componentsusuallyhavethreeforms:Buttoncomponents.

Itisasegmentofflashanimation,whichcanbeplayedindependentlyofthemainanimation.Themovieclipcanbeanintegralpartofthemainanimation.Whenthemainanimationisplayed,themovieclipcomponentwillalsobeplayedinaloop.

Themoviefragmentsintheflashmoviehavetheirowntimelineandattributes.Itisinteractiveandisthemostversatileandfunctionalpart.Itcancontainexamplesofinteractivecontrols,sounds,andothermovieclips,anditcanalsobeplacedinthetimelineofthebuttoncomponenttocreateananimationbutton.

Buttoncomponents:interactivecontrolbuttonsusedtocreateanimationstocorrespondtothemousetime(suchasclick,release,etc.).Thebuttonhasfourdifferentstateframesofup,over,down,andhit.Differentcontentcanbecreatedonthedifferentstateframesofthebutton.Itcanbeastillgraphicoramovieclip,anditcangivethebuttonfieldtime.Interactiveactionsmakethebuttonshaveinteractivefunctions.

Graphiccomponent:Agraphiccomponentisareusablegraphic,whichcanbeacomponentofamovieclipcomponentorascene.Thegraphicelementisastillpicturewithoneframe,whichisoneofthebasicelementsformakinganimation,butitcannotaddinteractivebehaviorandsoundcontrol.

Graphicelementsinflasharesuitableforthereuseofstaticimages,ortocreateanimationsassociatedwiththemaintimeline.Itcannotprovideaninstancename,norcanitbereferencedinActionScript.

Method1:Createanewblankcomponent,andtheninsertthecontentofthecomponentinthecomponenteditingstate.Selectthemenu"Insert"->"NewComponent"orpressthekeyboardctrl+F8tocreateanewcomponent.

Method2:Convertobjectsonthesceneintocomponents.Selectanexistingcomponentinthescene,clicktherightmousebutton,andselectConverttocomponent.

Method3:Convertanimationtocomponents.

Eachcomponenthasamaximumpowerlimit,whetheritisanactivedevice(suchasamplifier)orPassivecomponents(suchascablesorfilters).Understandinghowpowerflowsinthesecomponentshelpstohandlehigherpowerlevelswhendesigningcircuitsandsystems.

Howmuchpowercanithandle?Thisisanunavoidablequestiontomostofthecomponentsinthetransmitter,andthequestionisusuallypassivecomponents,suchasfilters,Couplerandantenna.However,withthepowerlevelofmicrowavevacuumtubes(suchastravelingwavetubes(TWT))andcoreactivedevices(suchassiliconlaterallydiffusedmetaloxidesemiconductor(LDMOS)transistorsandgalliumnitride(GaN)fieldeffecttransistors(FET))Wheninstalledinawell-designedamplifiercircuit,theywillalsobelimitedbythepowerhandlingcapabilitiesofcomponentssuchasconnectorsandevenprintedcircuitboard(PCB)materials.Understandingthelimitationsofthedifferentcomponentsthatmakeupahigh-powercomponentorsystemcanhelpanswerthislong-standingquestion.

Thetransmitterrequiresthepowertobewithinthelimit.Generallyspeaking,theselimitsarestipulatedbygovernmentagencies,suchasthecommunicationstandardsestablishedbytheFederalCommunicationsCommission(FCC)intheUnitedStates.Butin"unregulated"systems,suchasradarandelectronicwarfare(EW)platforms,therestrictionsaremainlyduetotheelectroniccomponentsinthesystem.

Whencurrentflowsthroughthecircuit,partoftheelectricalenergywillbeconvertedintoheat.Circuitsthathandlelargeenoughcurrentswillheatup-especiallyinplaceswithhighresistance,suchasdiscreteresistors.Thebasicideaof​​settingpowerlimitsforcircuitsorsystemsistouselowoperatingtemperaturestopreventanytemperaturerisethatmaydamagethecircuitorsystemcomponentsormaterials,suchasthedielectricmaterialsusedinprintedcircuitboards.Interruptionswhencurrent/heatflowsthroughthecircuit(suchaslooseorsolderedconnectors)canalsocausethermaldiscontinuitiesorhotspots,whichcancausedamageorreliabilityissues.Temperatureeffects,includingdifferencesinthecoefficientofthermalexpansion(CTE)betweendifferentmaterials,canalsocausereliabilityproblemsinhigh-frequencycircuitsandsystems.

Theheatalwaysflowsfromthehighertemperatureareatothelowertemperaturearea.Thisprinciplecanbeusedtotransfertheheatgeneratedbythehigh-powercircuitawayfromtheheatsource,suchasatransistororTWT.Ofcourse,theheatdissipationpathfromtheheatsourceshouldincludeadestinationcomposedofmaterialsthatcanclearordissipateheat,suchasametalgroundlayeroraheatsink.Inanycase,thethermalmanagementofanycircuitorsystemcanonlybeoptimallyachievedifitisconsideredatthebeginningofthedesigncycle.

Generally,thermalconductivityisusedtocomparetheperformanceofmaterialsusedtomanageheatinRF/microwavecircuits.Thisindexismeasuredbythepower(W/mK)appliedpermeterofmaterialperdegree(inKelvin).Perhapsthemostimportantfactorofthesematerialsforanyhigh-frequencycircuitisthePCBstackup,whichgenerallyhaslowthermalconductivity.Forexample,FR4laminatematerialsoftenusedinlow-costhigh-frequencycircuits,theirtypicalthermalconductivityisonly0.25W/mK.

Incontrast,copper(depositedonFR4asagroundplaneorcircuittrace)hasathermalconductivityof355W/mK.Copperhasalargeheatflowcapacity,whileFR4hasalmostnegligiblethermalconductivity.Inordertopreventhotspotsonthecoppertransmissionline,itisnecessarytoprovideahighthermalconductivitypathfromthetransmissionlinetothegroundplane,heatsinkorsomeotherhighthermalconductivityarea.ThinnerPCBmaterialallowsshorterpathstothegroundplane,becauseplatedvias(PTH)canbeusedtoconnectthecircuittracestothegroundplane.

Ofcourse,thepowerhandlingcapabilityofaPCBisafunctionofmanyfactors,includingconductorwidth,groundplanespacing,andmaterialdissipationfactor(loss).Inaddition,thedielectricconstantofthematerialwilldeterminethecircuitsizeatagivenidealcharacteristicimpedance,suchas50Ω,somaterialswithhigherdielectricconstantvalues​​allowcircuitdesignerstoreducethesizeoftheirRF/microwavecircuits.Inotherwords,theseshortermetaltracesmeanthatPCBdielectricmaterialswithhigherthermalconductivityarerequiredtoachievecorrectthermalmanagement.

Underagivenapplicationpowerlevel,circuitmaterialswithhigherthermalconductivityhavealowertemperaturerisethanmaterialswithlowerthermalconductivity.Unfortunately,FR4isnodifferentfrommanyotherPCBmaterialswithlowthermalconductivity.However,theheattreatmentandpowerhandlingcapabilitiesofthecircuitcanbeimprovedbyspecifyingtheuseofPCBmaterialsthathaveahigherthermalconductivitythanFR4atleast.

Forexample,althoughthethermalconductivityofcopperhasnotyetreachedthelevel,severalofRogers’PCBmaterialscanprovidemuchhigherthermalconductivitythanFR4.ThethermalconductivityofRO4350Bmaterialis0.62W/mK,whilethecompany’sRO4360laminatehasathermalconductivityof0.80W/mK.Althoughthereisnosignificantimprovement,itdoeshavetwotothreetimestheheat/powercapacityimprovementcomparedwithFR4stack,whichcanrealizetheeffectivedissipationoftheheatgeneratedbytheRF/microwavecircuit.Thesetwomaterialsareparticularlysuitableforamplifierapplicationswithabuilt-inheatsource(transistor).Theybothhavealowcoefficientofthermalexpansion(CTE)value,sotheycanminimizedimensionalchangeswithtemperature.

Manycommercialcomputer-aidedengineering(CAE)softwaredesignpackagescanmodeltheheatflowthroughtheRF/microwavecircuitunderthegivenapplicationpowerlevelandthegivencircuitparametersettings,includingtheheatofthePCB.Conductivity.Thesesoftwaredesignpackagescontainmanyindividualprograms,suchasSonnetSoftware’selectromagneticsimulation(EM)tool,Fluent’sIcePaksoftware,ANSYS’TASPCBsoftware,andFlomerics’Flothermsoftware.Theyalsoincludemanydesignsoftwaretoolsuites,suchasAgilent'sAdvancedDesignSystem(ADS),ComputerSimulationTechnology(CST)'sCSTMicrowaveStudio,andAWR'sMicrowaveOffice.

ThesesoftwaretoolscanevenbeusedtostudytheimpactofdifferentworkingenvironmentsonthepowerprocessingcapabilitiesofRF/microwavecircuits,suchasthosethatmayoccuratsufficientlyhighpowerlevelsintheaircraft’slowatmosphericpressureorhighaltitudeenvironmentArc.TheseprogramscanalsoimprovethepowerhandlingcapabilitiesofdiscreteRF/microwavecomponentsbymodelingthefielddistributionofenergyflowingthroughcomponents(suchascouplersorfilters).

Ofcourse,PCBmaterialisnottheonlyfactorthataffectsheatflowinRF/microwavecircuitsorsystems.Thelimitationsofcablesandconnectorsonpower/heatinhighfrequencysystemsarealsowellknown.Inacoaxialassembly,theconnectorcanusuallyhandlemoreheat/powerthanthecabletowhichitisconnected,anddifferentconnectorshavedifferentpowerratings.Forexample,thepowerratingoftheN-typeconnectorisslightlyhigherthanthatoftheSMAconnectorwithasmallersize(andhigherfrequencyrange).Theaveragepowerandpeakpowerofcablesandconnectorsarerated,andthepeakpowerisequaltoV2/Z,whereZisthecharacteristicimpedanceandVisthepeakvoltage.Asimplemethodofestimatingtheaveragepowerratingistomultiplythepeakpowerratingofthecableassemblybythedutycycle.

ManycablesupplierssuchasAstrolabhavedevelopedspecialcalculationprogramstocalculatethepowerhandlingcapacityoftheircoaxialcableassemblies.Somecompanies,suchasTimesMicrowaveSystems,providefreedownloadablecalculationprogramsthatcanbeusedtopredictthepowerhandlingcapabilitiesoftheirowndifferenttypesofcoaxialcables.

Itisworthnotingthatthisisanextremelysimplistictreatmentofcomplextopics.Italsodoesnotcovertopicssuchasmaterialbreakdownvoltage,PCBdissipationfactor(dissipationfactor),howthecircuit’spowerhandlingcapacityisaffected,theimpactonPCBmaterialcoefficientofthermalexpansion(CTE)performance,andthedifferenceinheatingeffectsbetweencontinuouswaveandpulsedenergysources.

Incomponents,circuits,andsystems,therearemanycomplexphenomenathatmayaffectthepowerprocessingcapabilities,includingcomponentswithdifferentRF/microwavepowercapabilitiessuchasswitcheswith"on"and"off"states.Inadditiontosoftwareprograms,toolsthatcanbeusedforthermalanalysiscanalsoprovidethermalimagingcapabilitiesbasedoninfrared(IR)technology,whichcanbeusedtosafelystudyheataccumulationincomponents,circuits,andsystems.