DPSS is a referred to as a full solidarity semiconductor laser. The latest developments in narrow pulse width, short-wavelength UV pump solid lasers (DPSS, DIODE PUMPED STATE LASER) have promoted the development of industrial production systems. In the past, DPSS lasers were more suitable for scientific research and were not suitable for industrial production. With the progress of the DPSS laser, many possible applications have been opened, including infrared, pulse continuous waves, and Q-switches produce pulse optical waves having multi-pulse width. Compared to other types of lasers, the DPSS laser has greater flexibility in regulating pulse shapes, repetition frequencies, and beam mass, which generate harmonics allows the user to obtain a shorter wavelength of a shorter wavelength suitable for processing of a plurality of materials.
The choice of the laser is not only related to the application, but also directly related to the characteristics of the laser beam. For example, the excimer laser for large area graphics can emit a thicker beam having a lower pulse repetition frequency (typically below 1 kHz). The excimer produces a laser beam having a high pulse energy having a medium pulse repetition frequency. The ND :YVO4-based DPSS laser can produce an infrared beam of approximately 1 gross M wavelength, using a harmonic oscillator (output green light), three times (output near ultraviolet light) or four times (Output of dark violent light).
1 photon cost cost
The cost of generating photons using ultraviolet DPSS lasers is higher than the cost of generating photons using the molecular laser, but compared to Below, the ultraviolet DPSS laser has the advantages of fast processing and high flexibility, high flexibility, high beam utilization efficiency and high productivity. In many applications, such as chip cutting or detailing holes, these advantages are sufficient to compensate for the difference cost; and the generalized laser exposure in annealing and large-area graphics processing of near-field mask imaging (cover here The mold has an advantage in the action of homogenization beams.
A 100W excimer laser can output approximately 60W effective operation power. The average price of the 100 W laser is approximately $ 140,000, and the cost of output power per watt is approximately $ 2,300. In contrast, a 266nm DPSS laser system of 2W output power is 130,000 US dollars, and the cost of each wattage is actually $ 65,000. Therefore, the cost of the excimer laser generates photons is much lower than the cost of ultraviolet photons. If a photon flunction is illuminated to remove a large amount of material on the chip, the cost performance of the excimer laser system is undoubtedly the most suitable; Using ultraviolet photons to reduce the cutting lines from 15 yields of the excimer laser beam to 5 .. m.
If the excimer laser does not use an expensive optical system, it cannot be focused into 5-way M small spot, and the DPSS laser can focus on 5-ym-m-spot spots using a cheaper optical system. In fact, 2W DPSS lasers are equivalent to the 6W excimer laser. If the 6W exciusal laser is obtained by a 60W laser system using its 10% time, then in this application, the DPSS laser has a high cost performance.
In the mid-1990s, people began to cut the blue-ray chip on the chip of the blue light-emitting diode using the molecular laser, and the sapphire chip on the spacecraft assembly. From 1998 to 1999, 25% of the laser beams in the excimer laser system can produce 3 chips per hour, using complex optical systems to geometric spurs, optimization, optimize, and then restocuse the beam to the chip.
Laser company has successfully developed a 266NM short pulse DPSS laser, usually 355 nm and 266 nm of two wavelengths. This laser can improve the processing yield of the chip, and 8 to 10 chips can be processed per hour.
When designing a DPSS laser for an application, a relatively good beam allows the user to concentrate a lot of light energy into a small spot. This optimized laser can perform a variety of machining tasks, such as machining grooves and a relatively deep hole. The DPSS laser must only have fewer light power than the laser beam that is difficult to focus on a lower brightness of small spot.
During the chip cutting or hard material, the DPSS laser can effectively penetrate the material in a small area, generally utilizing the imaging objective to focus a little beam, with the focus The spot is processed, and the excimer laser is imaged using an imaging objective to imaging the beam into a pattern. In fact, the user is a direct-related graphic of the DPSS laser, thereby having greater flexibility, such as controlling the profile shape of the spot moves to the graphic, and the circular corner, etc., and when the molecular laser is machined, the beam is focused. Take a linear beam, scratch in one direction, and the flexibility of the graphic drawn is poor.
2 Prevention is preferred to use the DPSS laser to process ceramics, sapphire, all II ~ VI materials, gallium gallium gallium gallium gallium , Indium phosphide, phosphide, gallium, and polymers. The parts should be avoided during processing, as the power density of radiation to the surface of the part is high in the case of high repetition frequencies, so that the temperature is rapidly increased. Several techniques have been able to maintain heat without invading the machined parts while rapid processing.
The power density and energy density are very important in processing. The basic physical meaning of the power density is: reach the number of pulses on the surface of the part every second; the energy density is a function of the beam focus density. Even with ultraviolet lasers, the processing of thermal overload will still happen. Short pulse DPSS lasers produce a small thermal affected area in material processing processing, while having flexible processing control. The number of pulses determine the cut depth, the high brightness (energy density) of short pulse laser provides a lot of superiority for fast processing processing.
Short pulse UV DPSS laser is processed by multi-photon absorption process. If more photons can be generated within a shorter period of time, the energy increases and the processing material is also removed. The laser used is 5 to 15 ns, while most commodity DPSS lasers are in the range of 20 to 100 ns. Scientists are studying picoseconds and femtosecond pulse laser systems.
The latest developments in DPSS laser technology and processing capacity and its improvement in robustness and reliability make it widely used in industrial processing. However, almost all lamp pump solid lasers have problems with changes in repetition frequencies and crystal materials, which means that the beam quality is dynamically changed. The newer solid laser uses a monochromatic beam pump of laser diodes, so that the heat is distributed to the laser rod, and the user can get a better focus beam. These new lasers have high reliability and service life is above 7,500 to more than 10000h. These lasers have very high reliability compared to the excimer lasers, which is especially important. The excimer laser requires more maintenance services. After 100 hours of operation, the optical system and replacement gas are required.
When purchasing a 266nmdpss laser, it is necessary to fully test it, so that the laser to purchase can meet the requirements you expect. The laser must be placed in a rugged packing machine in the industrial environment, so it is easy to integrate, long service life, simple maintenance and high machining accuracy, and does not need to replace the lamp, clean crystals, replace optical systems, and window parts or replacement gases.
JPSA Laser Company has designed and manufactured a laser beam transmission system, using improves the light beam transmission efficiency to obtain a high-processed output rate. However, there are still many problems in these lasers, because their operating range is 10kHz, 20kHz, 40kHz and 60kHz, so accumulated heat on the part. To better utilize these lasers, fast moving laser beam technologies are typically used, and air beams can also be integrated into the DPSS system to quickly and accurately move the laser beam.