Главне категорије
Антивирусне компоненте, електронске компоненте, пнеуматске компоненте, хале компоненте, флеш компоненте, хидрауличне компоненте, електричне компоненте, екскомпоненте.
Халл
Увод
ХаллelementisasemiconductorthatusestheХаллeffect.Itisgenerallyusedtodeterminetherotorspeedinamotor,suchasthemagneticDrums,coolingfansincomputers,etc.;isamagneticsensorbasedontheХаллeffect,whichhasdevelopedintoadiversefamilyofmagneticsensorproductsandhasbeenwidelyused.
Фабрицатионматериалс
Халементи се могу израдити од разних полупроводничких материјала, као што су Ге, Си, ИнСб, ГаАс, ИнАс, ИнАсП, и вишеслојни полупроводнички, хетероструктурни материјали квантне јаме, итд.
Предности
Халл уређаји имају многе предности, а њихова структура је чврста. Мала величина, лагана, дуготрајна, лака инсталација, мала потрошња, висока фреквенција (до 1 МХЗ), отпорност на вибрације, не боји се загађења или корозије прашином, уља, водене паре и соли.
Хидраулични
Класификација
Хидрауличне компоненте углавном укључују једносмерни вентил, вентил за смањење притиска, преливни вентил, вентил за регулацију притиска, вентил за регулацију протока, хидраулични цилиндархидрауличне пумпе, вентиле за хидрауличне моторе (притисни вентили, вентиле протока, повратне вентиле), хидрауличке додатке (прибор за вентиле, филтер за уље, вентил за пуњење, вентил за пуњење, филтер за уље, вентил за пуњење, вентил за пуњење.
Користи
Хидрауличниcomponentshaveawiderangeofuses.Хидрауличниpressmanufacturers,aswellasmetallurgicalsteelcompanies,usethemmoreoften,andtheyareanimportantpartofautomationequipment.
Пнеуматски
Класификација
Пнеуматске компоненте су генерално подељене на: цилиндар, брзи конектор, ограничавач протока цилиндра, пнеуматски вентил за одлагање, филтер, ПУ црево, минијатурни спојеви, универзални навојни спојеви, пнеуматски вентили, сушаре, вентили за растерећење притиска + електромагнетни вентил, контрола + цилиндар.
Апликација
Пнеуматскиcomponentscanbeusedin:foodindustry,clothingindustry,printingindustry,semiconductorindustry,automobileindustry.Ifyouputthepneumaticairsourcepart(compressedair,vacuum,airFilterunit);controlpart(varioussolenoidvalves,pneumaticvalves,manualvalves,speedcontrolvalves,on-offvalves,reliefvalves,pressurereducingvalves),executiveparts(pneumaticsuctioncups,cylinders,pneumaticfingers,etc. )повезано заједно.Ако погледате, наћи ћете да се кретање остварује помоћу електричне енергије може се реализовати пнеуматским.
Недостаци
However,thedisadvantagesofpneumaticcomponentsarepoorpositioningaccuracy(duringoperation)andhighnoise.
InFLASHanimationproduction,weoftenneedtousecomponents.
Дефиниција
Acomponentisagraphic,buttonorasmallanimationthatcanberepeatedlytakenout.Thesmallanimationinthecomponentcanbeplayedindependentlyofthemainanimation,andeachcomponentcanbemultipleindependentAcombinationofelements.Toputitbluntly,acomponentisequivalenttoareusabletemplate,andusingacomponentisequivalenttoinstantiatingacomponententity.Theadvantageofusingcomponentsisthattheycanbereused,reducingfilestoragespace.
Функција
TherearemanytimesintheFLASHthatneedtoreusematerials,thenwecanconvertthematerialsintocomponents,orsimplycreatenewcomponents.Inordertofacilitaterepeateduseoreditandmodifyagain.Componentscanalsobeunderstoodasoriginalmaterials,whichareusuallystoredinacomponentlibrary.Theelementcanbemodifiedagain,butmodifyingtheelementinthescenewillnotmodifythepropertiesoftheelementitself.
Цомпонентссуаллихаветхрееформс:Буттонцомпонентс.
Itisasegmentofflashanimation,whichcanbeplayedindependentlyofthemainanimation.Themovieclipcanbeanintegralpartofthemainanimation.Whenthemainanimationisplayed,themovieclipcomponentwillalsobeplayedinaloop.
Themoviefragmentsintheflashmoviehavetheirowntimelineandattributes.Itisinteractiveandisthemostversatileandfunctionalpart.Itcancontainexamplesofinteractivecontrols,sounds,andothermovieclips,anditcanalsobeplacedinthetimelineofthebuttoncomponenttocreateananimationbutton.
Buttoncomponents:interactivecontrolbuttonsusedtocreateanimationstocorrespondtothemousetime(suchasclick,release,etc.).Thebuttonhasfourdifferentstateframesofup,over,down,andhit.Differentcontentcanbecreatedonthedifferentstateframesofthebutton.Itcanbeastillgraphicoramovieclip,anditcangivethebuttonfieldtime.Interactiveactionsmakethebuttonshaveinteractivefunctions.
Graphiccomponent:Agraphiccomponentisareusablegraphic,whichcanbeacomponentofamovieclipcomponentorascene.Thegraphicelementisastillpicturewithoneframe,whichisoneofthebasicelementsformakinganimation,butitcannotaddinteractivebehaviorandsoundcontrol.
Graphicelementsinflasharesuitableforthereuseofstaticimages,ortocreateanimationsassociatedwiththemaintimeline.Itcannotprovideaninstancename,norcanitbereferencedinActionScript.
Method1:Createanewblankcomponent,andtheninsertthecontentofthecomponentinthecomponenteditingstate.Selectthemenu"Insert"->"NewComponent"orpressthekeyboardctrl+F8tocreateanewcomponent.
Method2:Convertobjectsonthesceneintocomponents.Selectanexistingcomponentinthescene,clicktherightmousebutton,andselectConverttocomponent.
Метод 3: Конвертовање у компоненте.
Eachcomponenthasamaximumpowerlimit,whetheritisanactivedevice(suchasamplifier)orPassivecomponents(suchascablesorfilters).Understandinghowpowerflowsinthesecomponentshelpstohandlehigherpowerlevelswhendesigningcircuitsandsystems.
Howmuchpowercanithandle?Thisisanunavoidablequestiontomostofthecomponentsinthetransmitter,andthequestionisusuallypassivecomponents,suchasfilters,Couplerandantenna.However,withthepowerlevelofmicrowavevacuumtubes(suchastravelingwavetubes(TWT))andcoreactivedevices(suchassiliconlaterallydiffusedmetaloxidesemiconductor(LDMOS)transistorsandgalliumnitride(GaN)fieldeffecttransistors(FET))Wheninstalledinawell-designedamplifiercircuit,theywillalsobelimitedbythepowerhandlingcapabilitiesofcomponentssuchasconnectorsandevenprintedcircuitboard(PCB)materials.Understandingthelimitationsofthedifferentcomponentsthatmakeupahigh-powercomponentorsystemcanhelpanswerthislong-standingquestion.
Thetransmitterrequiresthepowertobewithinthelimit.Generallyspeaking,theselimitsarestipulatedbygovernmentagencies,suchasthecommunicationstandardsestablishedbytheFederalCommunicationsCommission(FCC)intheUnitedStates.Butin"unregulated"systems,suchasradarandelectronicwarfare(EW)platforms,therestrictionsaremainlyduetotheelectroniccomponentsinthesystem.
Whencurrentflowsthroughthecircuit,partoftheelectricalenergywillbeconvertedintoheat.Circuitsthathandlelargeenoughcurrentswillheatup-especiallyinplaceswithhighresistance,suchasdiscreteresistors.Thebasicideaofsettingpowerlimitsforcircuitsorsystemsistouselowoperatingtemperaturestopreventanytemperaturerisethatmaydamagethecircuitorsystemcomponentsormaterials,suchasthedielectricmaterialsusedinprintedcircuitboards.Interruptionswhencurrent/heatflowsthroughthecircuit(suchaslooseorsolderedconnectors)canalsocausethermaldiscontinuitiesorhotspots,whichcancausedamageorreliabilityissues.Temperatureeffects,includingdifferencesinthecoefficientofthermalexpansion(CTE)betweendifferentmaterials,canalsocausereliabilityproblemsinhigh-frequencycircuitsandsystems.
Theheatalwaysflowsfromthehighertemperatureareatothelowertemperaturearea.Thisprinciplecanbeusedtotransfertheheatgeneratedbythehigh-powercircuitawayfromtheheatsource,suchasatransistororTWT.Ofcourse,theheatdissipationpathfromtheheatsourceshouldincludeadestinationcomposedofmaterialsthatcanclearordissipateheat,suchasametalgroundlayeroraheatsink.Inanycase,thethermalmanagementofanycircuitorsystemcanonlybeoptimallyachievedifitisconsideredatthebeginningofthedesigncycle.
Generally,thermalconductivityisusedtocomparetheperformanceofmaterialsusedtomanageheatinRF/microwavecircuits.Thisindexismeasuredbythepower(W/mK)appliedpermeterofmaterialperdegree(inKelvin).Perhapsthemostimportantfactorofthesematerialsforanyhigh-frequencycircuitisthePCBstackup,whichgenerallyhaslowthermalconductivity.Forexample,FR4laminatematerialsoftenusedinlow-costhigh-frequencycircuits,theirtypicalthermalconductivityisonly0.25W/mK.
Incontrast,copper(depositedonFR4asagroundplaneorcircuittrace)hasathermalconductivityof355W/mK.Copperhasalargeheatflowcapacity,whileFR4hasalmostnegligiblethermalconductivity.Inordertopreventhotspotsonthecoppertransmissionline,itisnecessarytoprovideahighthermalconductivitypathfromthetransmissionlinetothegroundplane,heatsinkorsomeotherhighthermalconductivityarea.ThinnerPCBmaterialallowsshorterpathstothegroundplane,becauseplatedvias(PTH)canbeusedtoconnectthecircuittracestothegroundplane.
Ofcourse,thepowerhandlingcapabilityofaPCBisafunctionofmanyfactors,includingconductorwidth,groundplanespacing,andmaterialdissipationfactor(loss).Inaddition,thedielectricconstantofthematerialwilldeterminethecircuitsizeatagivenidealcharacteristicimpedance,suchas50Ω,somaterialswithhigherdielectricconstantvaluesallowcircuitdesignerstoreducethesizeoftheirRF/microwavecircuits.Inotherwords,theseshortermetaltracesmeanthatPCBdielectricmaterialswithhigherthermalconductivityarerequiredtoachievecorrectthermalmanagement.
Underagivenapplicationpowerlevel,circuitmaterialswithhigherthermalconductivityhavealowertemperaturerisethanmaterialswithlowerthermalconductivity.Unfortunately,FR4isnodifferentfrommanyotherPCBmaterialswithlowthermalconductivity.However,theheattreatmentandpowerhandlingcapabilitiesofthecircuitcanbeimprovedbyspecifyingtheuseofPCBmaterialsthathaveahigherthermalconductivitythanFR4atleast.
Forexample,althoughthethermalconductivityofcopperhasnotyetreachedthelevel,severalofRogers’PCBmaterialscanprovidemuchhigherthermalconductivitythanFR4.ThethermalconductivityofRO4350Bmaterialis0.62W/mK,whilethecompany’sRO4360laminatehasathermalconductivityof0.80W/mK.Althoughthereisnosignificantimprovement,itdoeshavetwotothreetimestheheat/powercapacityimprovementcomparedwithFR4stack,whichcanrealizetheeffectivedissipationoftheheatgeneratedbytheRF/microwavecircuit.Thesetwomaterialsareparticularlysuitableforamplifierapplicationswithabuilt-inheatsource(transistor).Theybothhavealowcoefficientofthermalexpansion(CTE)value,sotheycanminimizedimensionalchangeswithtemperature.
Manycommercialcomputer-aidedengineering(CAE)softwaredesignpackagescanmodeltheheatflowthroughtheRF/microwavecircuitunderthegivenapplicationpowerlevelandthegivencircuitparametersettings,includingtheheatofthePCB.Conductivity.Thesesoftwaredesignpackagescontainmanyindividualprograms,suchasSonnetSoftware’selectromagneticsimulation(EM)tool,Fluent’sIcePaksoftware,ANSYS’TASPCBsoftware,andFlomerics’Flothermsoftware.Theyalsoincludemanydesignsoftwaretoolsuites,suchasAgilent'sAdvancedDesignSystem(ADS),ComputerSimulationTechnology(CST)'sCSTMicrowaveStudio,andAWR'sMicrowaveOffice.
ThesesoftwaretoolscanevenbeusedtostudytheimpactofdifferentworkingenvironmentsonthepowerprocessingcapabilitiesofRF/microwavecircuits,suchasthosethatmayoccuratsufficientlyhighpowerlevelsintheaircraft’slowatmosphericpressureorhighaltitudeenvironmentArc.TheseprogramscanalsoimprovethepowerhandlingcapabilitiesofdiscreteRF/microwavecomponentsbymodelingthefielddistributionofenergyflowingthroughcomponents(suchascouplersorfilters).
Ofcourse,PCBmaterialisnottheonlyfactorthataffectsheatflowinRF/microwavecircuitsorsystems.Thelimitationsofcablesandconnectorsonpower/heatinhighfrequencysystemsarealsowellknown.Inacoaxialassembly,theconnectorcanusuallyhandlemoreheat/powerthanthecabletowhichitisconnected,anddifferentconnectorshavedifferentpowerratings.Forexample,thepowerratingoftheN-typeconnectorisslightlyhigherthanthatoftheSMAconnectorwithasmallersize(andhigherfrequencyrange).Theaveragepowerandpeakpowerofcablesandconnectorsarerated,andthepeakpowerisequaltoV2/Z,whereZisthecharacteristicimpedanceandVisthepeakvoltage.Asimplemethodofestimatingtheaveragepowerratingistomultiplythepeakpowerratingofthecableassemblybythedutycycle.
ManycablesupplierssuchasAstrolabhavedevelopedspecialcalculationprogramstocalculatethepowerhandlingcapacityoftheircoaxialcableassemblies.Somecompanies,suchasTimesMicrowaveSystems,providefreedownloadablecalculationprogramsthatcanbeusedtopredictthepowerhandlingcapabilitiesoftheirowndifferenttypesofcoaxialcables.
Itisworthnotingthatthisisanextremelysimplistictreatmentofcomplextopics.Italsodoesnotcovertopicssuchasmaterialbreakdownvoltage,PCBdissipationfactor(dissipationfactor),howthecircuit’spowerhandlingcapacityisaffected,theimpactonPCBmaterialcoefficientofthermalexpansion(CTE)performance,andthedifferenceinheatingeffectsbetweencontinuouswaveandpulsedenergysources.
Incomponents,circuits,andsystems,therearemanycomplexphenomenathatmayaffectthepowerprocessingcapabilities,includingcomponentswithdifferentRF/microwavepowercapabilitiessuchasswitcheswith"on"and"off"states.Inadditiontosoftwareprograms,toolsthatcanbeusedforthermalanalysiscanalsoprovidethermalimagingcapabilitiesbasedoninfrared(IR)technology,whichcanbeusedtosafelystudyheataccumulationincomponents,circuits,andsystems.