Perustiedot
Johdanto
Ei-metalliset merkintäkoneet,kiinteät lasermerkintäkoneet ja kaasulasermerkintäkoneet (CO2laserleikkauskone)onkevytkevyt,johdantaputkenjohtimenvaloon. sitten laserpäähän asennettu tarkennuslinssi kokoaa valon yhdeksi pisteeksi., Ja tämä piste voi saavuttaa korkean lämpötilan, joten materiaali sublimoituu välittömästi kaasuksi,joka imeytyy poispoistotuulettimesta, jotta saavutetaan leikkaustarkoitus; kutsutaan CO2laserleikkauskoneeksi.
Ceramicsubstrateprocessingapplication
Inordertodividetheceramicsubstrateintoindependentparts,alasermarkingmachinecanbeusedtomark(drill)aseriesofpartial(unpassed)hightoleranceholes.Theseholesareapproximatelyone-thirdofthedepthofthesubstrate,generatingpreferentialfaultlinesforlaterrupture.Usingothertechniques,itisalsopossibletoprocessvias,slots,anddeterminetopographyandfinepatternsonthesubstrate.
Yleisesti käytetyn keramiikan absorptio-ominaisuuksien vuoksi CO2-lasereista on tullut valinnanvaraa.Pulsoidun CO2-lasersäteilyn energiaabsorboituu ly75-300m,paksuudesta riippuen),Gauss-säteen energiaprofiilin matalaenergiareunan alla,koska lämpövaikutusalue (HAZ) paikallisen sulamisen aiheuttama.
Formanyyears,CO2laserswillconsumealotofresourcesintermsofgasandenergywhenworkinginlongshifts,andrequireamaintenanceplan.Inaddition,thepulseparameterstypicallyusedinthisapplicationmeanthatthesealedtubeCO2lasertechnologyisnotsuitable.Onthewhole,afteryearsofextensiveimprovements,CO2lasersarestillbehindothertechnologiesintermsofreliabilityandmaintenanceissues.Duringmaintenance,thebeamqualityoftheselasersisstilleasytochange;thesmallestspotsizethatcanbeachievedisalsosusceptibletolongwaves.Individually,thelaserbeamabsorptioncharacteristicsofceramicshaveallowedthistechnologytoinfluencethismarketforalongtime.
Newscribingtechnology
PreviousattemptstoapplyNd:YAGlaserstothescribingprocesswereunsuccessfulbecausetheabsorptionof1.064μmwastooweak;therewasnotenoughenergydepositedonthesurfacelayertoproduceThedesiredeffect.Tothisend,SynchronLaserService(locatedinSouthLyon,Michigan,USA)hasdevelopedsurfacetreatmenttechnologytoenhancetheabsorptionoflaserlightbyceramicsinashorterwavelengthrange.Thisprocessquicklyandslightlydipsintotheceramicsurfaceandintensifiesthedepositionenergyofthenear-infraredlaserpulseatashortenoughdistancetoproducethenecessarymeltingandvaporization.Combiningthispatent-pendingsurfacetreatmenttechnologywiththefiberlasertechnologyofSPILasers(locatedinSouthampton,UK),theprocessperformanceachievedfarexceedstheprocessperformancethatcanbeachievedbyusingaCO2lasermarkingmachine.
Surfacetreatmentgreatlyenhancesthefiberlaserbeamintotheceramictopsurfacetostartthedrillingprocess.Theenhancedpoweroftheinteractionbetweenthelaserpulseandthesurfaceofthematerial,combinedwithacustomizedhigh-resolutionbeamdeliverysystemthatensuresconsistentspotsizeonthesurface,meansthatsmallertopographycanbeachievedontheceramicsubstrate.Synchronalsoconsideredsomeotherexistinglasertechnologies,hopingtobeabletoprocessevenfinerscribing;buttheconclusionisthatnotechnologycanachievethetargetspeedinitsownuniqueway,insomecasesatleast10timesslower.
ComparedwithCO2lasers,fiberlasersshowbetterconsistencyandreliability,andcanprocessfinertopography,includingthreetimestheedgequalityafterfractureabove.Figure5furthershowstheedgequalitythatcanbeachieved.Herewedescribetheoriginaledgecreatedbycuttingthearrowshape.Importantly,thenewprocesscanevenachieveproductionspeedsthatcannotbeachievedwithCO2lasers.
Ona0.0150inchthickaluminumoxidesubstrate,thescribingspeedexceeds1300inchesperminute,whichisabouttwicethatofaCO2laser(both30%deep);butthemachiningspeedisatleasttheaveragevalue.Inmostcases,thespeedexceedsthatofCO2lasers.AccordingtoSynchron,theuseofmobilecontrolsystemsinsteadoflasershasledtolimitedproduction.
Aluminumoxideandaluminumnitrideceramicscanbeprocessedinthisup-to-dateway.Whenaluminaisused,theprocesslimitisuptoasubstratethicknessofabout0.060inches,althoughthickermaterialsforharsherapplicationsarerequiredforlongerperiodsoftime.Thickersubstratescanalsoprovidemoreheatdissipation,forexampleinhigh-brightnessLEDapplications.
Aluminumnitrideceramicsaregenerallymoredifficulttoprocessthanaluminabecauseofbetterthermalconductivity,soprocessingrequiresproportionallygreaterpower.Ontheotherhand,afinermorphologycanbeachieved,becauseonlythehighestdensitypartofthebeamcanproducetherequiredprocess,andthehighthermalconductivityofthematerialminimizestheHAZonbothsidesofthebeamenergyprofile.Theinitialresultsofusingthisnewmethodareexcellent,andtheprocessusingthismaterialcanstillbefine-tuned.
Processimprovement
Fiberlaserscanprovideaseriesofuniquepropertiesandareusedinawiderangeofmaterialprocessing.Forexample,areliableGaussianbeamprofile(TEM00)isimportantforachievingandmaintainingaconsistentspotsizeonthesurface.Fiberlasersperformwellinthisrespect,andalloutputpowersexhibitaparticularlyhigh-qualitybeamdistribution,thusallowinglargeworkingdistances(independent).Anotheradvantageisthatthesmallspotsizeandthehigh-qualitylightbeamareconvertedintothehigh-brightnesslightofthefocalpoint,whichrealizesreliableprocessing,highaccuracy,andminimumHAZ.
Fiberlaserscanjointlyachievethegreatestreductioninoperatingcoststhroughthefollowingseveralways:reducedmaintenancecosts,noalignmentorcalibrationrequirements,longeruptime,andimprovedproductionqualityathigheryields.Fiberlasersarecompactanddurable,sotheyaresuitableforthemostchallengingindustrialenvironments.
Synchron'sproprietarytechnologyhasbrokenthroughanewfieldoftechnologicalprogressintheindustry,thatis,itcannotmatchtheprocessingofothermaterialsintheproductionofconsumerelectronicproducts.Therearerelativelyfewindustrygiants.Ontheonehand,thecostofcompetitionishigh,andontheotherhand,itisnecessarytomaintainflexibilityandchangeincustomerdemand.Facedwiththissituation,anytechnologicaladvancementmayleadtowinningimportantmarkets.
Thereducedprofilesizeachievedbythecombinationoffiberlaserandproprietarysurfacemodificationtechnologyopensthedoorforfinerscribingofelectronicproduct-gradeceramicprocessing.Themonthlyoutputusuallyexceeds10millionpieces,whichcaneasilymeetthehoneycombtype.Telephonesandmusicplayers,aswellashigh-densityLEDsforbacklightingandautomotiveapplications,requiretheproductionoflarge-scaleconsumerelectronicsproducts.Infact,someindustriesarerequiringceramicsubstrateholes<0.003inches,andtheaccuracyisbetterthan0.0005inches.ItisnoteasytoachievethisresolutionwithCO2lasermarkingmachines,butSynchron’snewmethodhasbeenThislevelisreachedinmassproduction.
Surfacetreatmentcanbesprayed,dippedorrolled,anddoesnotrequirealotofdryingtime.Theapplicationofceramicsurfacetreatmentdoesnotincreaseotherprocesssteps,becausesometypesofcoatingsteps(usuallyanti-spatterlayers)aremorecommonfortheestablishedCO2processingtechnology.Inaddition,theresiduesproducedbythenewprocessarelessactiveandinsmallerquantities,whichwillonlyeliminatetheproblemofsplashing.
Processingthefinermorphologyofceramicsubstratesathigherspeedsbringsadvantagestotheelectronicsindustryintermsofdesign,performanceandcost.Fiberlaserscanhelpachieveabetterbalanceamongtheimportantcriteriarequiredbyviablecompetition:usuallyeffectiveopticalperformance,processflexibility,highoutput,long-termsystemoperation,andreliability.InthecaseofSynchron,fiberlasershelptoensurealevelofceramicprocessingperformancethatcouldnotbeachievedbefore
Muut
Teolliset sovellukset
Maailman ensimmäinen CO2Laserleikkauskoneuusinsyntyi 1970-luvulla.Jo yli 30 vuotta,johtuen sovellusalan jatkuvastalaajentumisesta. 2laserleikkauskonemarkkinoiden tarpeiden täyttämiseksi.Kaksi -dimensionalflatcuttingmachine,tree-dimensionalspacecurvecuttingmachine,pipecuttingmachine,etne 325,jossa yhteensä1,174 miljardia Yhdysvaltain dollaria..Vaikka laserleikkauksen kehitystrendi on suhteellisen nopea, sovellustaso on huomattavasti jäljessä kehittyneisiin maihin verrattuna.Vuodesta 2003 lähtien CO:n kokonaismäärä2 Esimerkki CO2-laserleikkausprosessiparametreista ei-metallisille materiaaleille Materiaali Paksuus/mm Leikkausnopeus/(cm/min) Apukaasunpaine/Mpa Leikkausleveys/mm 0,25 Pleksilasi 10 80 N2 0,7 Polyesterihuopa 10 260 N2 0,5 Kangas (monikerroksinen) 15 90 N2 0,5 Pahvi 0,5 300 N2 0.4 2.6 300 N2 0,5 Kvartsilasi 1.9 60 0,2 Polypropeenilevy 5.5 70 N2 0,5 Polystyreenilevy 3.2 420 N2 0.4 0.5 PVC-levy 4 170 Ilma,0,15 —— pleksilasi 10 120 Viisikerroksinen liimalevy 5 210 1.0 Kuitulevy 15.6 450 N2 —— Monikerroksinen vaneri 6.2 900 PVClaminaatti 3.1 1050 Sahanpurulauta 3.9 1800 3.1 2250 akryyliamidilevy 2.8 3390 3.2 2970 3.5 2720 0,05 akryyli 2.0 100 —— —— Keinonahka 0,8 250 0.3 kipsilevy 9.0 50 —— —— vaneri 10.0 110 Lämpöä estävä lasi 2.2 50 Kumiarkki 5 50 Nahkaa 4 220 Kemiallinen kuitukangas 6.5 220 0,75 1200 LasertypeCO2suledlasstubelaser Työtasoindeksointialusta Enintään yhden näytön kaiverrusmuoto 250 mm × 250 mm–450 mm × 450 mm Motionsystem offline-tai online-liikkeenhallinta, 5 tuuman LCD-näyttö Virtalähde 220V±10%50Hz Tue grafiikkamuotoja AI, BMP, PLT, DXF, DST jne. Vakio500W-savunimuri Valinnainenerikoisautomaattinen syöttölaite,kylmävesikone (ei varustettu ilmajäähdytyksellä) SuitableforCO2lasercuttingmachinesmainlyincludespecialpartsthatrequireuniformcutting,advertisements,decorations,etc.Stainlesssteelwithathicknessofnotmorethanthreemillimetersandnon-metallicmaterialswithathicknessofnotmorethan20millimetersusedintheserviceindustry,andOneistoprocessworkpieceswithcomplexcuttingcontoursbutasmallamounttosavethecostandcycleofmanufacturingmolds.> > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > Tekniset parametrit
Applicableindustries
