Hardware development

Developmentprocess

1.Clarifytheoverallhardwarerequirements,suchasCPUprocessingcapacity,storagecapacityandspeed,I/Oportallocation,interfacerequirements,levelrequirements,andspecialcircuitrequirementsEtc.

2.Developanoverallhardwareplanbasedondemandanalysis,seekforkeycomponentsandtheirtechnicaldata,technicalapproaches,andtechnicalsupport.Itisnecessarytofullyconsidertechnicalpossibilities,reliabilityandcostcontrol,andtodevelopThedebuggingtoolputsforwardclearrequirements,andsamplesofkeycomponentsarerequested.

3.Performdetailedhardwaredesign,includingdrawinghardwareschematicdiagrams,single-boardfunctionalblockdiagramsandcoding,PCBwiring,andcompletingdevelopmentbillsofmaterials,productiondocuments(Gerber),andmaterialapplications.

4.AfterreceivingthePCBboardandmaterials,arrangetoweld2~4singleboardsforsingleboarddebugging,commissioningeachfunctionintheprincipledesign,modifytheschematicdiagramandrecordifnecessary.

5.Softwareandhardwaresystemjointdebugging,generalsingleboardrequiresthecooperationofhardwarepersonnelandsingleboardsoftwarepersonnel.Aftersingleboarddebugging,therearesomeadjustmentsinprincipleandPCBwiring,andthesecondboardisrequired..

6.Internalacceptanceandtransfertopilottest,duringtrialproduction,followuptheproblemsoftheproductionline,activelyassisttheproductionlinetosolvevariousproblems,improvethegoodrate,andpavethewayformassproduction.

7.Smallbatchproduction.Aftertheproducthaspassedtheinspection,itisnecessarytocarryoutsmallbatchproduction,findouttheproductionprocess,testtheprocess,andprepareformassproduction.

8.Massproduction.AfterthesmallbatchproductionhasverifiedthatthereisnoproblemwiththeR&D,testing,andmassproductionprocessofafullsetofelectronicproducts,massproductioncanbestarted.

Documentspecification

1Introductiontothespecificationfileofhardwaredevelopmentdocumentation

Tostandardizethewritingofdocumentsinthehardwaredevelopmentprocess,clarifytheformatandcontentofthedocument,andspecifythehardwaredevelopmentThelistofdocumentsrequiredintheprocessistoformulatethe"HardwareDevelopmentDocumentPreparationSpecification"correspondingtothe"HardwareDevelopmentProcess".Developersoftenmisssomecontentthatshouldbewrittenwhenwritingdocuments,andthecompilationspecificationalsohasacertainpromptingeffectwhendeveloperswritedocuments.The"HardwareDevelopmentDocumentationSpecification"isapplicabletothedocumentationofthedevelopmentandtestingphasesofthehardwaresystemoftheprojectgroupingproject.TheCCPliststhespecificationsofthefollowingdocuments:

2Detailedspecificationofhardwaredevelopmentdocumentation

1、Hardwarerequirementspecification

Thehardwarerequirementspecificationdescribesthehardwaredevelopmentgoals,basicfunctions,basicconfiguration,mainperformanceindicators,operatingenvironment,constraintconditions,developmentfundsandprogressrequirements,anditsrequirementsarebasedonproductspecificationsInstructionsandsystemrequirementsinstructions.Itisthebasisfortheoverallhardwaredesignandtheformulationofthehardwaredevelopmentplan.

Thespecificcontentsinclude:systemengineeringnetworkingandinstructionsforuse,basicfunctionsandmainperformanceindicatorsoftheoverallhardwaresystem,andbasichardwaresub-systemsFunctionsandmainperformanceindicators,aswellasthedivisionoffunctionalmodules,etc.

2.Hardwareoveralldesignreport

Thehardwareoveralldesignreportisareportproducedaftertheoveralldesignaccordingtotherequirementsoftherequirementsspecification.Itisthebasisforthedetailedhardwaredesign.Thepreparationoftheoverallhardwaredesignreportshouldincludethefollowing:

Theoverallsystemstructureandfunctiondivision,thesystemlogicalblockdiagram,thelogicalblockdiagramofthefunctionalmodulesthatmakeupthesystem,thecircuitstructurediagramandthesingleboardcomposition,thesingleboardlogicalblockdiagramandCircuitstructurediagram,aswellasreliability,safety,electromagneticcompatibilitydiscussionandhardwaretestplans,etc.

3.Theoveralldesignplanofthesingleboard

Thisdocumentshouldbeissuedaftertheoveralldesignplanofthesingleboardisdetermined.Theoveralldesignplanofthesingleboardshouldincludethesingleboardversionnumber,Theboard'spositioninthewholemachine,developmentpurposeandmainfunctions,singleboardfunctiondescription,singleboardlogicalblockdiagramanddescriptionofeachfunctionmodule,singleboardsoftwarefunctiondescriptionandfunctionmoduledivision,simpledefinitionofinterfaceandrelationshipwithrelatedboards,mainperformanceIndicators,powerconsumptionandadoptionstandards.

4.Detailedsingle-boardhardwaredesign

Whenthesingle-boardhardwareentersthedetaileddesignstage,adetailedsingle-boardhardwaredesignreportshouldbesubmitted.Thedetaileddesignofthesingle-boardhardwareshouldfocuson:thesingle-boardlogicblockdiagramanddetaileddescriptionofeachfunctionalmodule,theimplementationofeachfunctionalmodule,addressallocation,controlmode,interfacemode,memoryspace,interruptmode,interfacepinsignaldetailsDefinitions,timingdescriptions,performanceindicators,indicatordescriptions,externalwiringdefinitions,programmabledevicediagrams,functionalmoduledescriptions,schematicdiagrams,detailedbillsofmaterials,andsingleboardtestinganddebuggingplans.Sometimesthehardwareandsoftwareofasingleboardareseparatelydevelopedbytwodevelopers.Therefore,thedetaileddesignofthesingleboardhardwareprovidesadetailedguideforthesoftwaredesigneratthistime.Therefore,thedetaileddesignreportofthesingleboardhardwareisveryimportant.Inparticular,addressallocation,controlmode,interfacemode,andinterruptmodearethebasisforprogrammingsingle-boardsoftwareandmustbewrittenindetail.

5.Detaileddesignofsingle-boardsoftware

Afterthesingle-boardsoftwaredesigniscompleted,adetailedsingle-boardsoftwaredesignreportshouldbecompletedaccordingly,andthecompletionofthesingle-boardsoftwareprogrammingshouldbelistedinthereportLanguage,compilerdebuggingenvironment,hardwaredescriptionandfunctionalrequirementsanddatastructure,etc.Itshouldbeparticularlyemphasizedthatthedetaileddesigndetailsshouldbelistedindetail,includinginterrupts,mainroutines,subroutinefunctions,entryparameters,exitparameters,localvariables,functioncallsandflowcharts.Inthedescriptionofthecommunicationprotocol,itshouldbeexplainedwhichdocumentsdefinethephysicallayer,linklayercommunicationprotocolandhigh-levelcommunicationprotocol.

6.Singleboardhardwareprocessdebuggingdocument

Duringthedevelopmentprocess,everytimeaPCBboardisinvested,theengineershouldsubmitaprocessdocumentsothatthemanagementcanunderstandtheprogressandconductanevaluation.Inaddition,italsoleavesareferencevaluetechnicaldocumentforotherrelevantengineers.ThisdocumentshouldbemadeeverytimeaPCBboardisinvested.Thisdocumentshouldincludethefollowingcontent:thedivisionofsingle-boardhardwarefunctionmodules,thedebuggingprogressofeachmoduleofthesingle-boardhardware,theproblemsandsolutionsduringdebugging,theoriginaldatarecord,thesystemplanmodificationinstructions,thesingleboardplanmodificationinstructions,thedevicereplacementinstructions,Schematicdiagram,PCBdiagrammodificationdescription,programmabledevicemodificationdescription,debuggingworkstagesummary,debuggingprogressdescription,nextstagedebuggingplanandtestplanmodification.

7.Single-boardsoftwareprocessdebuggingdocuments

Collectthesingle-boardsoftwareprocessdebuggingdocumentsonceamonth,orcollectafterthedebugging(referringtolessthanonemonth),asclearaspossibleandcompletethelistTheprocessofsoftwaredebuggingandmodificationispresented.Thesingle-boardsoftwareprocessdebuggingdocumentationshallincludethefollowingcontent:thedivisionofsingle-boardsoftwarefunctionmodulesandthedebuggingprogressofeachfunctionmodule,theproblemsandsolutionsofsingle-boardsoftwaredebugging,thedebuggingplanforthenextstage,andthemodificationofthetestplan.

8.Single-boardsystemjointdebuggingreport

Whentheprojectentersthesingle-boardsystemjointdebuggingstage,asingle-boardsystemjointdebuggingreportshouldbeissued.Thesingle-boardsystemjointdebuggingreportincludesthesecontents:systemfunctionmoduledivision,systemfunctionmoduledebuggingprogress,systeminterfacesignaltestoriginalrecordandanalysis,systemjointdebuggingproblemsandsolutions,debuggingskillscollection,overallmachineperformanceevaluation,etc.

9.Singleboardhardwaretestdocument

Afterthesingleboardisdebugged,beforeapplyingforinternalacceptance,self-testshouldbecarriedouttoensurethateachfunctioncanberealized,andeachindicatorCanbesatisfied.Aftertheself-testiscompleted,asingle-boardhardwaretestdocumentshouldbeissued.Thesingle-boardhardwaretestdocumentincludesthefollowing:thedivisionofsingle-boardfunctionalmodules,thedesignofinputandoutputsignalsandperformanceparametersofeachfunctionalmodule,thedeterminationofthetestpointsofeachfunctionalmodule,andtheoriginalmeasurementofeachtestreferencepoint.Recordingandanalysis,theoriginalrecordandanalysisofthehigh-speedsignallinetestintheboard,theoriginalrecordandanalysisofthesystemI/Oportsignallinetest,andtheanalysisoftheoverallboardperformancetestresults.

10.HardwareInformationLibrary

Inordertosharetechnicaldata,wehopetoestablishashareddatalibrary.EachboardhopestoincludethemostvaluableandcharacteristicdataintoThislibrary.Thehardwareinformationlibraryincludesthefollowingcontent:typicalapplicationcircuit,characteristiccircuit,characteristicchiptechnologyintroduction,characteristicchipuseinstruction,driverflowchart,sourceprogram,relatedhardwarecircuitdescription,PCBlayoutprecautions,singleboarddebuggingTypicalandsolution,softwareandhardwaredesignanddebuggingskills.

Follow-upprocess

Aftertheelectronicproductisdeveloped,itgenerallyneedstohaveahousingorstructuretofixtheelectronicproduct.Undernormalcircumstances,itwillnotdirectlyholdthecircuitboard.Use,sotherearealsoprocessessuchasmolddesign,shapedesign,moldopening,andtrialassembly.Thereareaboutmorethan20processestocompleteanelectronicproductresearchanddevelopmentprocess,andthemorecomplicatedonesareevenmorecomplicated.

Itcanbesaidthateachelectronicproductdevelopmenthasitsowncharacteristics,otherwiseitwillbecomethesameelectronicproduct.Therefore,whenencounteringspecificelectronicproductdevelopment,itisnecessarytoconductaspecialanalysisbasedonitsfunctionalcharacteristics..