Процес на разработка
1. Изяснете общите хардуерни изисквания, като капацитет за обработка на CPU, капацитет за съхранение и скорост, разпределение на I/Port, изисквания за интерфейс, изисквания за ниво и изисквания за специални схеми и др.
2.Developanoverallhardwareplanbasedondemandanalysis,seekforkeycomponentsandtheirtechnicaldata,technicalapproaches,andtechnicalsupport.Itisnecessarytofullyconsidertechnicalpossibilities,reliabilityandcostcontrol,andtodevelopThedebuggingtoolputsforwardclearrequirements,andsamplesofkeycomponentsarerequested.
3.Извършване на подробен дизайн на хардуер, включително чертане на схематични диаграми на хардуер, функционални блокови диаграми и кодиране на една платка, PCB окабеляване и попълване на сметки за разработка на материали, производствени документи (Gerber) и приложения на материали.
4.AfterreceivingthePCBboardandmaterials,arrangetoweld2~4singleboardsforsingleboarddebugging,commissioningeachfunctionintheprincipledesign,modifytheschematicdiagramandrecordifnecessary.
5.Softwareandhardwaresystemjointdebugging,generalsingleboardrequiresthecooperationofhardwarepersonnelandsingleboardsoftwarepersonnel.Aftersingleboarddebugging,therearesomeadjustmentsinprincipleandPCBwiring,andthesecondboardisrequired..
6.Internalacceptanceandtransfertopilottest,duringtrialproduction,followuptheproblemsoftheproductionline,activelyassisttheproductionlinetosolvevariousproblems,improvethegoodrate,andpavethewayformassproduction.
7.Smallbatchproduction.Aftertheproducthaspassedtheinspection,itisnecessarytocarryoutsmallbatchproduction,findouttheproductionprocess,testtheprocess,andprepareformassproduction.
8.Massproduction.AfterthesmallbatchproductionhasverifiedthatthereisnoproblemwiththeR&D,testing,andmassproductionprocessofafullsetofelectronicproducts,massproductioncanbestarted.
Спецификация на документа
1Въведение във файла със спецификации на документацията за разработка на хардуер
Tostandardizethewritingofdocumentsinthehardwaredevelopmentprocess,clarifytheformatandcontentofthedocument,andspecifythehardwaredevelopmentThelistofdocumentsrequiredintheprocessistoformulatethe"HardwareDevelopmentDocumentPreparationSpecification"correspondingtothe"HardwareDevelopmentProcess".Developersoftenmisssomecontentthatshouldbewrittenwhenwritingdocuments,andthecompilationspecificationalsohasacertainpromptingeffectwhendeveloperswritedocuments.The"HardwareDevelopmentDocumentationSpecification"isapplicabletothedocumentationofthedevelopmentandtestingphasesofthehardwaresystemoftheprojectgroupingproject.TheCCPliststhespecificationsofthefollowingdocuments:
1 | Спецификация на хардуерните изисквания |
2 | Отчет за цялостния дизайн на хардуера |
3 | Единичен цялостен дизайн на хардуера на платката |
4 | Подробно проектиране на хардуер за една платка |
5 | Документация за отстраняване на грешки на хардуерен процес на Singleboard |
6 | Отчет за отстраняване на грешки в хардуерната система на Singleboard |
7 | Документ за тестване на хардуер на Singleboard |
8 | Подробна документация на архива на хардуерното цялостно решение |
9 | Подробна документация за архива на цялата хардуерна едноплаткова схема |
10 td> | HardwareInformationLibrary |
2Подробна спецификация на документацията за разработка на хардуер
1、Спецификация на хардуерните изисквания
Thehardwarerequirementspecificationdescribesthehardwaredevelopmentgoals,basicfunctions,basicconfiguration,mainperformanceindicators,operatingenvironment,constraintconditions,developmentfundsandprogressrequirements,anditsrequirementsarebasedonproductspecificationsInstructionsandsystemrequirementsinstructions.Itisthebasisfortheoverallhardwaredesignandtheformulationofthehardwaredevelopmentplan.
Thespecificcontentsinclude:systemengineeringnetworkingandinstructionsforuse,basicfunctionsandmainperformanceindicatorsoftheoverallhardwaresystem,andbasichardwaresub-systemsFunctionsandmainperformanceindicators,aswellasthedivisionoffunctionalmodules,etc.
2.Доклад за цялостния дизайн на хардуера
Thehardwareoveralldesignreportisareportproducedaftertheoveralldesignaccordingtotherequirementsoftherequirementsspecification.Itisthebasisforthedetailedhardwaredesign.Thepreparationoftheoverallhardwaredesignreportshouldincludethefollowing:
Theoverallsystemstructureandfunctiondivision,thesystemlogicalblockdiagram,thelogicalblockdiagramofthefunctionalmodulesthatmakeupthesystem,thecircuitstructurediagramandthesingleboardcomposition,thesingleboardlogicalblockdiagramandCircuitstructurediagram,aswellasreliability,safety,electromagneticcompatibilitydiscussionandhardwaretestplans,etc.
3.Общият план за проектиране на единичната платка
Thisdocumentshouldbeissuedaftertheoveralldesignplanofthesingleboardisdetermined.Theoveralldesignplanofthesingleboardshouldincludethesingleboardversionnumber,Theboard'spositioninthewholemachine,developmentpurposeandmainfunctions,singleboardfunctiondescription,singleboardlogicalblockdiagramanddescriptionofeachfunctionmodule,singleboardsoftwarefunctiondescriptionandfunctionmoduledivision,simpledefinitionofinterfaceandrelationshipwithrelatedboards,mainperformanceIndicators,powerconsumptionandadoptionstandards.
4. Подробен хардуерен дизайн на една платка
Whenthesingle-boardhardwareentersthedetaileddesignstage,adetailedsingle-boardhardwaredesignreportshouldbesubmitted.Thedetaileddesignofthesingle-boardhardwareshouldfocuson:thesingle-boardlogicblockdiagramanddetaileddescriptionofeachfunctionalmodule,theimplementationofeachfunctionalmodule,addressallocation,controlmode,interfacemode,memoryspace,interruptmode,interfacepinsignaldetailsDefinitions,timingdescriptions,performanceindicators,indicatordescriptions,externalwiringdefinitions,programmabledevicediagrams,functionalmoduledescriptions,schematicdiagrams,detailedbillsofmaterials,andsingleboardtestinganddebuggingplans.Sometimesthehardwareandsoftwareofasingleboardareseparatelydevelopedbytwodevelopers.Therefore,thedetaileddesignofthesingleboardhardwareprovidesadetailedguideforthesoftwaredesigneratthistime.Therefore,thedetaileddesignreportofthesingleboardhardwareisveryimportant.Inparticular,addressallocation,controlmode,interfacemode,andinterruptmodearethebasisforprogrammingsingle-boardsoftwareandmustbewrittenindetail.
5. Подробен дизайн на софтуер с една платка
Afterthesingle-boardsoftwaredesigniscompleted,adetailedsingle-boardsoftwaredesignreportshouldbecompletedaccordingly,andthecompletionofthesingle-boardsoftwareprogrammingshouldbelistedinthereportLanguage,compilerdebuggingenvironment,hardwaredescriptionandfunctionalrequirementsanddatastructure,etc.Itshouldbeparticularlyemphasizedthatthedetaileddesigndetailsshouldbelistedindetail,includinginterrupts,mainroutines,subroutinefunctions,entryparameters,exitparameters,localvariables,functioncallsandflowcharts.Inthedescriptionofthecommunicationprotocol,itshouldbeexplainedwhichdocumentsdefinethephysicallayer,linklayercommunicationprotocolandhigh-levelcommunicationprotocol.
6.Документ за отстраняване на грешки в хардуерен процес на единична платка
Duringthedevelopmentprocess,everytimeaPCBboardisinvested,theengineershouldsubmitaprocessdocumentsothatthemanagementcanunderstandtheprogressandconductanevaluation.Inaddition,italsoleavesareferencevaluetechnicaldocumentforotherrelevantengineers.ThisdocumentshouldbemadeeverytimeaPCBboardisinvested.Thisdocumentshouldincludethefollowingcontent:thedivisionofsingle-boardhardwarefunctionmodules,thedebuggingprogressofeachmoduleofthesingle-boardhardware,theproblemsandsolutionsduringdebugging,theoriginaldatarecord,thesystemplanmodificationinstructions,thesingleboardplanmodificationinstructions,thedevicereplacementinstructions,Schematicdiagram,PCBdiagrammodificationdescription,programmabledevicemodificationdescription,debuggingworkstagesummary,debuggingprogressdescription,nextstagedebuggingplanandtestplanmodification.
7.Документи за отстраняване на грешки на софтуерен процес с една платка
Collectthesingle-boardsoftwareprocessdebuggingdocumentsonceamonth,orcollectafterthedebugging(referringtolessthanonemonth),asclearaspossibleandcompletethelistTheprocessofsoftwaredebuggingandmodificationispresented.Thesingle-boardsoftwareprocessdebuggingdocumentationshallincludethefollowingcontent:thedivisionofsingle-boardsoftwarefunctionmodulesandthedebuggingprogressofeachfunctionmodule,theproblemsandsolutionsofsingle-boardsoftwaredebugging,thedebuggingplanforthenextstage,andthemodificationofthetestplan.
8.Съвместен отчет за отстраняване на грешки на система с една платка
Whentheprojectentersthesingle-boardsystemjointdebuggingstage,asingle-boardsystemjointdebuggingreportshouldbeissued.Thesingle-boardsystemjointdebuggingreportincludesthesecontents:systemfunctionmoduledivision,systemfunctionmoduledebuggingprogress,systeminterfacesignaltestoriginalrecordandanalysis,systemjointdebuggingproblemsandsolutions,debuggingskillscollection,overallmachineperformanceevaluation,etc.
9.Документ за тестване на хардуер на единична платка
Afterthesingleboardisdebugged,beforeapplyingforinternalacceptance,self-testshouldbecarriedouttoensurethateachfunctioncanberealized,andeachindicatorCanbesatisfied.Aftertheself-testiscompleted,asingle-boardhardwaretestdocumentshouldbeissued.Thesingle-boardhardwaretestdocumentincludesthefollowing:thedivisionofsingle-boardfunctionalmodules,thedesignofinputandoutputsignalsandperformanceparametersofeachfunctionalmodule,thedeterminationofthetestpointsofeachfunctionalmodule,andtheoriginalmeasurementofeachtestreferencepoint.Recordingandanalysis,theoriginalrecordandanalysisofthehigh-speedsignallinetestintheboard,theoriginalrecordandanalysisofthesystemI/Oportsignallinetest,andtheanalysisoftheoverallboardperformancetestresults.
10.Библиотека с информация за хардуера
Inordertosharetechnicaldata,wehopetoestablishashareddatalibrary.EachboardhopestoincludethemostvaluableandcharacteristicdataintoThislibrary.Thehardwareinformationlibraryincludesthefollowingcontent:typicalapplicationcircuit,characteristiccircuit,characteristicchiptechnologyintroduction,characteristicchipuseinstruction,driverflowchart,sourceprogram,relatedhardwarecircuitdescription,PCBlayoutprecautions,singleboarddebuggingTypicalandsolution,softwareandhardwaredesignanddebuggingskills.
Follow-upprocess
Aftertheelectronicproductisdeveloped,itgenerallyneedstohaveahousingorstructuretofixtheelectronicproduct.Undernormalcircumstances,itwillnotdirectlyholdthecircuitboard.Use,sotherearealsoprocessessuchasmolddesign,shapedesign,moldopening,andtrialassembly.Thereareaboutmorethan20processestocompleteanelectronicproductresearchanddevelopmentprocess,andthemorecomplicatedonesareevenmorecomplicated.
Itcanbesaidthateachelectronicproductdevelopmenthasitsowncharacteristics,otherwiseitwillbecomethesameelectronicproduct.Therefore,whenencounteringspecificelectronicproductdevelopment,itisnecessarytoconductaspecialanalysisbasedonitsfunctionalcharacteristics..