Основни категории
Антивирусни компоненти, електронни компоненти, пневматични компоненти, компоненти на Хол, флаш компоненти, хидравлични компоненти, електрически компоненти, компоненти.
Хол
Въведение
ХолelementisasemiconductorthatusestheХолeffect.Itisgenerallyusedtodeterminetherotorspeedinamotor,suchasthemagneticDrums,coolingfansincomputers,etc.;isamagneticsensorbasedontheХолeffect,whichhasdevelopedintoadiversefamilyofmagneticsensorproductsandhasbeenwidelyused.
Материали за изработка
Халелементите могат да бъдат произведени с разнообразие от полупроводникови материали, като Ge, Si, InSb, GaAs, InAs, InAsP и многослойни полупроводникови хетероструктурни материали за квантови кладенци и др.
Предимства
Холните устройства имат много предимства и структурата им е здрава. Малък размер, лек, дълъг живот, лесна инсталация, ниска консумация на енергия, висока честота (до 1 MHZ), устойчивост на вибрации, не се страхуват от замърсяване или корозия от прах, масло, водни пари и спрей със сол.
Хидравлични
Класификация
Хидравличните компоненти включват основно еднопосочен вентил, редуциращ клапан, преливен клапан, клапан за регулиране на налягането, клапан за регулиране на дебита, хидравличен цилиндър, хидравлични помпи, хидравлични моторни вентили (клапани за налягане, вентили за потока, реверсивни клапани), хидравлични аксесоари (устройства за маслени филтри, уплътнителни пръстени, тръбни съединения), и реверсивни клапани, комплекти електромагнитни клапани,
Употреби
Хидравличниcomponentshaveawiderangeofuses.Хидравличниpressmanufacturers,aswellasmetallurgicalsteelcompanies,usethemmoreoften,andtheyareanimportantpartofautomationequipment.
Пневматичен
Класификация
Пневматичните компоненти обикновено се разделят на: цилиндър, бърза връзка, ограничител на потока на цилиндър, пневматичен забавящ клапан, филтър, маркучи, миниатюрни съединения, универсални резбови съединения, пневматични клапани, сушилни, клапани за освобождаване на налягането + електромагнитен клапан за управление + цилиндри и др.
Приложение
Пневматиченcomponentscanbeusedin:foodindustry,clothingindustry,printingindustry,semiconductorindustry,automobileindustry.Ifyouputthepneumaticairsourcepart(compressedair,vacuum,airFilterunit);controlpart(varioussolenoidvalves,pneumaticvalves,manualvalves,speedcontrolvalves,on-offvalves,reliefvalves,pressurereducingvalves),executiveparts(pneumaticsuctioncups,cylinders,pneumaticfingers,etc. )свързани заедно. Ако го погледнете, ще откриете, че движението, реализирано от електрическа енергия, може да се реализира от пневматично.
Недостатъци
However,thedisadvantagesofpneumaticcomponentsarepoorpositioningaccuracy(duringoperation)andhighnoise.
InFLASHanimationproduction,weoftenneedtousecomponents.
Определение
Acomponentisagraphic,buttonorasmallanimationthatcanberepeatedlytakenout.Thesmallanimationinthecomponentcanbeplayedindependentlyofthemainanimation,andeachcomponentcanbemultipleindependentAcombinationofelements.Toputitbluntly,acomponentisequivalenttoareusabletemplate,andusingacomponentisequivalenttoinstantiatingacomponententity.Theadvantageofusingcomponentsisthattheycanbereused,reducingfilestoragespace.
функция
TherearemanytimesintheFLASHthatneedtoreusematerials,thenwecanconvertthematerialsintocomponents,orsimplycreatenewcomponents.Inordertofacilitaterepeateduseoreditandmodifyagain.Componentscanalsobeunderstoodasoriginalmaterials,whichareusuallystoredinacomponentlibrary.Theelementcanbemodifiedagain,butmodifyingtheelementinthescenewillnotmodifythepropertiesoftheelementitself.
Компонентите обикновено имат три форми: Компоненти на бутони.
Itisasegmentofflashanimation,whichcanbeplayedindependentlyofthemainanimation.Themovieclipcanbeanintegralpartofthemainanimation.Whenthemainanimationisplayed,themovieclipcomponentwillalsobeplayedinaloop.
Themoviefragmentsintheflashmoviehavetheirowntimelineandattributes.Itisinteractiveandisthemostversatileandfunctionalpart.Itcancontainexamplesofinteractivecontrols,sounds,andothermovieclips,anditcanalsobeplacedinthetimelineofthebuttoncomponenttocreateananimationbutton.
Buttoncomponents:interactivecontrolbuttonsusedtocreateanimationstocorrespondtothemousetime(suchasclick,release,etc.).Thebuttonhasfourdifferentstateframesofup,over,down,andhit.Differentcontentcanbecreatedonthedifferentstateframesofthebutton.Itcanbeastillgraphicoramovieclip,anditcangivethebuttonfieldtime.Interactiveactionsmakethebuttonshaveinteractivefunctions.
Graphiccomponent:Agraphiccomponentisareusablegraphic,whichcanbeacomponentofamovieclipcomponentorascene.Thegraphicelementisastillpicturewithoneframe,whichisoneofthebasicelementsformakinganimation,butitcannotaddinteractivebehaviorandsoundcontrol.
Graphicelementsinflasharesuitableforthereuseofstaticimages,ortocreateanimationsassociatedwiththemaintimeline.Itcannotprovideaninstancename,norcanitbereferencedinActionScript.
Method1:Createanewblankcomponent,andtheninsertthecontentofthecomponentinthecomponenteditingstate.Selectthemenu"Insert"->"NewComponent"orpressthekeyboardctrl+F8tocreateanewcomponent.
Method2:Convertobjectsonthesceneintocomponents.Selectanexistingcomponentinthescene,clicktherightmousebutton,andselectConverttocomponent.
Метод 3: Преобразуване на анимация в компоненти.
Eachcomponenthasamaximumpowerlimit,whetheritisanactivedevice(suchasamplifier)orPassivecomponents(suchascablesorfilters).Understandinghowpowerflowsinthesecomponentshelpstohandlehigherpowerlevelswhendesigningcircuitsandsystems.
Howmuchpowercanithandle?Thisisanunavoidablequestiontomostofthecomponentsinthetransmitter,andthequestionisusuallypassivecomponents,suchasfilters,Couplerandantenna.However,withthepowerlevelofmicrowavevacuumtubes(suchastravelingwavetubes(TWT))andcoreactivedevices(suchassiliconlaterallydiffusedmetaloxidesemiconductor(LDMOS)transistorsandgalliumnitride(GaN)fieldeffecttransistors(FET))Wheninstalledinawell-designedamplifiercircuit,theywillalsobelimitedbythepowerhandlingcapabilitiesofcomponentssuchasconnectorsandevenprintedcircuitboard(PCB)materials.Understandingthelimitationsofthedifferentcomponentsthatmakeupahigh-powercomponentorsystemcanhelpanswerthislong-standingquestion.
Thetransmitterrequiresthepowertobewithinthelimit.Generallyspeaking,theselimitsarestipulatedbygovernmentagencies,suchasthecommunicationstandardsestablishedbytheFederalCommunicationsCommission(FCC)intheUnitedStates.Butin"unregulated"systems,suchasradarandelectronicwarfare(EW)platforms,therestrictionsaremainlyduetotheelectroniccomponentsinthesystem.
Whencurrentflowsthroughthecircuit,partoftheelectricalenergywillbeconvertedintoheat.Circuitsthathandlelargeenoughcurrentswillheatup-especiallyinplaceswithhighresistance,suchasdiscreteresistors.Thebasicideaofsettingpowerlimitsforcircuitsorsystemsistouselowoperatingtemperaturestopreventanytemperaturerisethatmaydamagethecircuitorsystemcomponentsormaterials,suchasthedielectricmaterialsusedinprintedcircuitboards.Interruptionswhencurrent/heatflowsthroughthecircuit(suchaslooseorsolderedconnectors)canalsocausethermaldiscontinuitiesorhotspots,whichcancausedamageorreliabilityissues.Temperatureeffects,includingdifferencesinthecoefficientofthermalexpansion(CTE)betweendifferentmaterials,canalsocausereliabilityproblemsinhigh-frequencycircuitsandsystems.
Theheatalwaysflowsfromthehighertemperatureareatothelowertemperaturearea.Thisprinciplecanbeusedtotransfertheheatgeneratedbythehigh-powercircuitawayfromtheheatsource,suchasatransistororTWT.Ofcourse,theheatdissipationpathfromtheheatsourceshouldincludeadestinationcomposedofmaterialsthatcanclearordissipateheat,suchasametalgroundlayeroraheatsink.Inanycase,thethermalmanagementofanycircuitorsystemcanonlybeoptimallyachievedifitisconsideredatthebeginningofthedesigncycle.
Generally,thermalconductivityisusedtocomparetheperformanceofmaterialsusedtomanageheatinRF/microwavecircuits.Thisindexismeasuredbythepower(W/mK)appliedpermeterofmaterialperdegree(inKelvin).Perhapsthemostimportantfactorofthesematerialsforanyhigh-frequencycircuitisthePCBstackup,whichgenerallyhaslowthermalconductivity.Forexample,FR4laminatematerialsoftenusedinlow-costhigh-frequencycircuits,theirtypicalthermalconductivityisonly0.25W/mK.
Incontrast,copper(depositedonFR4asagroundplaneorcircuittrace)hasathermalconductivityof355W/mK.Copperhasalargeheatflowcapacity,whileFR4hasalmostnegligiblethermalconductivity.Inordertopreventhotspotsonthecoppertransmissionline,itisnecessarytoprovideahighthermalconductivitypathfromthetransmissionlinetothegroundplane,heatsinkorsomeotherhighthermalconductivityarea.ThinnerPCBmaterialallowsshorterpathstothegroundplane,becauseplatedvias(PTH)canbeusedtoconnectthecircuittracestothegroundplane.
Ofcourse,thepowerhandlingcapabilityofaPCBisafunctionofmanyfactors,includingconductorwidth,groundplanespacing,andmaterialdissipationfactor(loss).Inaddition,thedielectricconstantofthematerialwilldeterminethecircuitsizeatagivenidealcharacteristicimpedance,suchas50Ω,somaterialswithhigherdielectricconstantvaluesallowcircuitdesignerstoreducethesizeoftheirRF/microwavecircuits.Inotherwords,theseshortermetaltracesmeanthatPCBdielectricmaterialswithhigherthermalconductivityarerequiredtoachievecorrectthermalmanagement.
Underagivenapplicationpowerlevel,circuitmaterialswithhigherthermalconductivityhavealowertemperaturerisethanmaterialswithlowerthermalconductivity.Unfortunately,FR4isnodifferentfrommanyotherPCBmaterialswithlowthermalconductivity.However,theheattreatmentandpowerhandlingcapabilitiesofthecircuitcanbeimprovedbyspecifyingtheuseofPCBmaterialsthathaveahigherthermalconductivitythanFR4atleast.
Forexample,althoughthethermalconductivityofcopperhasnotyetreachedthelevel,severalofRogers’PCBmaterialscanprovidemuchhigherthermalconductivitythanFR4.ThethermalconductivityofRO4350Bmaterialis0.62W/mK,whilethecompany’sRO4360laminatehasathermalconductivityof0.80W/mK.Althoughthereisnosignificantimprovement,itdoeshavetwotothreetimestheheat/powercapacityimprovementcomparedwithFR4stack,whichcanrealizetheeffectivedissipationoftheheatgeneratedbytheRF/microwavecircuit.Thesetwomaterialsareparticularlysuitableforamplifierapplicationswithabuilt-inheatsource(transistor).Theybothhavealowcoefficientofthermalexpansion(CTE)value,sotheycanminimizedimensionalchangeswithtemperature.
Manycommercialcomputer-aidedengineering(CAE)softwaredesignpackagescanmodeltheheatflowthroughtheRF/microwavecircuitunderthegivenapplicationpowerlevelandthegivencircuitparametersettings,includingtheheatofthePCB.Conductivity.Thesesoftwaredesignpackagescontainmanyindividualprograms,suchasSonnetSoftware’selectromagneticsimulation(EM)tool,Fluent’sIcePaksoftware,ANSYS’TASPCBsoftware,andFlomerics’Flothermsoftware.Theyalsoincludemanydesignsoftwaretoolsuites,suchasAgilent'sAdvancedDesignSystem(ADS),ComputerSimulationTechnology(CST)'sCSTMicrowaveStudio,andAWR'sMicrowaveOffice.
ThesesoftwaretoolscanevenbeusedtostudytheimpactofdifferentworkingenvironmentsonthepowerprocessingcapabilitiesofRF/microwavecircuits,suchasthosethatmayoccuratsufficientlyhighpowerlevelsintheaircraft’slowatmosphericpressureorhighaltitudeenvironmentArc.TheseprogramscanalsoimprovethepowerhandlingcapabilitiesofdiscreteRF/microwavecomponentsbymodelingthefielddistributionofenergyflowingthroughcomponents(suchascouplersorfilters).
Ofcourse,PCBmaterialisnottheonlyfactorthataffectsheatflowinRF/microwavecircuitsorsystems.Thelimitationsofcablesandconnectorsonpower/heatinhighfrequencysystemsarealsowellknown.Inacoaxialassembly,theconnectorcanusuallyhandlemoreheat/powerthanthecabletowhichitisconnected,anddifferentconnectorshavedifferentpowerratings.Forexample,thepowerratingoftheN-typeconnectorisslightlyhigherthanthatoftheSMAconnectorwithasmallersize(andhigherfrequencyrange).Theaveragepowerandpeakpowerofcablesandconnectorsarerated,andthepeakpowerisequaltoV2/Z,whereZisthecharacteristicimpedanceandVisthepeakvoltage.Asimplemethodofestimatingtheaveragepowerratingistomultiplythepeakpowerratingofthecableassemblybythedutycycle.
ManycablesupplierssuchasAstrolabhavedevelopedspecialcalculationprogramstocalculatethepowerhandlingcapacityoftheircoaxialcableassemblies.Somecompanies,suchasTimesMicrowaveSystems,providefreedownloadablecalculationprogramsthatcanbeusedtopredictthepowerhandlingcapabilitiesoftheirowndifferenttypesofcoaxialcables.
Itisworthnotingthatthisisanextremelysimplistictreatmentofcomplextopics.Italsodoesnotcovertopicssuchasmaterialbreakdownvoltage,PCBdissipationfactor(dissipationfactor),howthecircuit’spowerhandlingcapacityisaffected,theimpactonPCBmaterialcoefficientofthermalexpansion(CTE)performance,andthedifferenceinheatingeffectsbetweencontinuouswaveandpulsedenergysources.
Incomponents,circuits,andsystems,therearemanycomplexphenomenathatmayaffectthepowerprocessingcapabilities,includingcomponentswithdifferentRF/microwavepowercapabilitiessuchasswitcheswith"on"and"off"states.Inadditiontosoftwareprograms,toolsthatcanbeusedforthermalanalysiscanalsoprovidethermalimagingcapabilitiesbasedoninfrared(IR)technology,whichcanbeusedtosafelystudyheataccumulationincomponents,circuits,andsystems.